JPH0170349U - - Google Patents
Info
- Publication number
- JPH0170349U JPH0170349U JP1987166095U JP16609587U JPH0170349U JP H0170349 U JPH0170349 U JP H0170349U JP 1987166095 U JP1987166095 U JP 1987166095U JP 16609587 U JP16609587 U JP 16609587U JP H0170349 U JPH0170349 U JP H0170349U
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- sealing
- flexible
- sealing structure
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166095U JPH0170349U (en]) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166095U JPH0170349U (en]) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170349U true JPH0170349U (en]) | 1989-05-10 |
Family
ID=31453175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166095U Pending JPH0170349U (en]) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170349U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134272A (ja) * | 2010-12-21 | 2012-07-12 | Nec Corp | 部品内蔵モジュール及びこれを備える電子機器並びに部品内蔵モジュールの製造方法 |
| JP2016539034A (ja) * | 2013-09-27 | 2016-12-15 | タクトテク オーユー | 電気機械的構造体を製造するための方法およびその方法を実施するための装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016574B2 (ja) * | 1977-04-15 | 1985-04-26 | 静岡製機株式会社 | 乾燥機における含水率自動測定装置 |
| JPS61176139A (ja) * | 1985-01-31 | 1986-08-07 | Alps Electric Co Ltd | 混成集積回路およびその製造方法 |
-
1987
- 1987-10-29 JP JP1987166095U patent/JPH0170349U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016574B2 (ja) * | 1977-04-15 | 1985-04-26 | 静岡製機株式会社 | 乾燥機における含水率自動測定装置 |
| JPS61176139A (ja) * | 1985-01-31 | 1986-08-07 | Alps Electric Co Ltd | 混成集積回路およびその製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134272A (ja) * | 2010-12-21 | 2012-07-12 | Nec Corp | 部品内蔵モジュール及びこれを備える電子機器並びに部品内蔵モジュールの製造方法 |
| JP2016539034A (ja) * | 2013-09-27 | 2016-12-15 | タクトテク オーユー | 電気機械的構造体を製造するための方法およびその方法を実施するための装置 |